Littelfuse SP3004 Series Instrukcja Użytkownika Pobierz pdf (Strona 3)

Speciﬁcations are subject to change without notice.

Revised: 04/24/13

TVS Diode Arrays (SPA

Diodes)

Low Capacitance ESD Protection - SP3004 Series

Capacitance vs. Frequency

2E-13

4E-13

6E-13

8E-13

1E-12

1.2E-12

1.4E-12

1.6E-12

1.8E-12

2E-12

1.E+06 1.E+07 1.E+08 1.E+09

Frequency [Hz]

Capacitance [F]

Product Characteristics

Lead Plating Pre-Plated Frame

Lead Material Copper Alloy

Lead Coplanarity 0.0004 inches (0.102mm)

Substitute Material Silicon

Body Material Molded Epoxy

Flammability UL 94 V-0

Notes :

1. All dimensions are in millimeters

2. Dimensions include solder plating.

3. Dimensions are exclusive of mold ﬂash & metal burr.

4. Blo is facing up for mold and facing down for trim/form, i.e. reverse trim/form.

5. Package surface matte ﬁnish VDI 11-13.

Time

Temperature

S(max)

S(min)

time to peak temperature

Preheat

rehea

Ramp-up

amp-up

Ramp-down

amp-d

Critical Zone

L to TP

ritical Zon

Reﬂow Condition Pb – Free assembly

Pre Heat

- Temperature Min (T

s(min)

) 150°C

- Temperature Max (T

s(max)

) 200°C

- Time (min to max) (t

) 60 – 180 secs

Average ramp up rate (Liquidus) Temp

) to peak

3°C/second max

S(max)

to T

- Ramp-up Rate 3°C/second max

Reﬂow

- Temperature (T

) (Liquidus) 217°C

- Temperature (t

) 60 – 150 seconds

Peak Temperature (T

) 260

+0/-5

°C

Time within 5°C of actual peak

Temperature (t

)

20 – 40 seconds

Ramp-down Rate 6°C/second max

Time 25°C to peak Temperature (T

) 8 minutes Max.

Do not exceed 260°C

Soldering Parameters

Leakage Current vs Temperature

/O to GND Leakage (pA)

Temperature ( ºC)

0 25 45 65

100

1000

5V Bias

3.3V Bias

1 2 3 4

Komentarze do niniejszej Instrukcji

Brak uwag

Littelfuse SP3004 Series Instrukcja Użytkownika Strona 3

Komentarze do niniejszej Instrukcji

Powiązane produkty i podręczniki dla Sprzęt komputerowy Littelfuse SP3004 Series