Littelfuse 804 Series Instrukcja Użytkownika Pobierz pdf (Strona 2)

Introduction to Circuit Protection

Transientology

Specications are subject to change without notice.

Please refer to www.littelfuse.com/series/804.html for current information.

TE-UMF 804 Series

Universal Modular Fuses

TE > Time Lag > 804 Series

Average Time Current CurvesTemperature Rerating Curve

Soldering Parameters - Wave Soldering

Dwell Time

100

120

140

160

180

200

220

240

260

280

300

100

110

120

130

140

150

160

170

180

190

200

210

220

230

240

Time (Seconds)

Temperature (°C) - Measured on bottom side of board

Cooling Time

Preheat Time

Wave Parameter Lead-Free Recommendation

Preheat:

(Depends on Flux Activation Temperature)

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Temperature Minimum:

100

° C

Temperature Maximum:

150

° C

Preheat Time: 60-180 seconds

Solder Pot Temperature:

260

° C Maximum

Solder Dwell Time: 2-5 seconds

Recommended Hand-Solder Parameters:

Solder Iron Temperature: 350° C +/- 5°C

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Note: These devices are not recommended for IR or

Convection Reow process.

Recommended Process Parameters:

20%

40%

60%

80%

100%

120%

140%

-55 -30 -5 20 45 70 95 120

AMBIENT TEMPERATURE (°C)

PERCENT OF RATING

804 DE-RATING CURVE

CURRENT [A]

Blowtime [sec].

0.1 1 10 100 1000

0.8A

1.25A

1.6A

2.5A

3.15A

6.3A

0.010

0.001

0.100

1.000

10.000

100.000

1000.000

1 2 3

Universal Modular Fuses 1

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