Littelfuse 2016L Series Instrukcja Użytkownika Strona 3

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47
Revised: March 19, 2012
POLY-FUSE
®
Resettable PTCs
© 2012 Littelfuse, Inc
2016L Series
Surface Mount > 2016L Series
2016L Series
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/series/2016L.html for current information.
Environmental Specifications
Soldering Parameters
Condition Reflow
Peak Temp/ Duration Time 260°C / 10 Sec
Time above liquids (TAL) 220°C 60 Sec ~ 100 Sec
Preheat 120°C~ 180°C 50 Sec ~ 150 Sec
Storage Condition ¡$_¡$
<
=
70%RH
t3FDPNNFOEFESFnPXNFUIPET*3WBQPSQIBTFPWFOIPUBJS
PWFO/
2
environment for lead–free
t3FDPNNFOEFENBYJNVNQBTUFUIJDLOFTTJTNNJODI
t%FWJDFTDBOCFDMFBOFEVTJOHTUBOEBSEJOEVTUSZNFUIPETBOE
solvents.
Note:*GSFnPXUFNQFSBUVSFTFYDFFEUIFSFDPNNFOEFEQSPmMF
devices may not meet the performance requirements.
Operating/Storage
Temperature
-40°C to +85°C
Maximum Device Surface
Temperature in Tripped
State
125°C
Passive Aging
¡$IPVST
-/+5% typical resistance change
Humidity Aging
¡$3)IPVST
-/+5% typical resistance change
Thermal Shock
.*-o45%o.FUIPE(
+85°C/-40°C 20 times
-30% typical resistance change
Solvent Resistance
.*-o45%o.FUIPE
/PDIBOHF
Vibration
.*-o45%o$.FUIPE
Condition A
/PDIBOHF
Moisture Sensitivity Level -FWFM+o45%o$
Physical Specifications
Terminal Material
Solder-Plated Copper (Solder Material:
Matte Tin(Sn))
Lead Solderability
.FFUT&*"4QFDJmDBUJPO34&"/4*
+45%$BUFHPSZ
Preheating
120
180
220
260
0
60 to 100
Temperature (°C)
Soldering Cooling
120
50 to 150
Time(s)
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