Littelfuse 157T Series Instrukcja Użytkownika Pobierz pdf (Strona 3)

Speciﬁcations are subject to change without notice.

Revised: 12/19/13

Surface Mount Fuses

NANO

2®

> 157T Fuse and Holder Combination

Materials

Body: Ceramic

Cap: For 0.375A ~ 5A – Silver plated Brass

Clip Plating: Matte Tin

Product

Marking

Body: Brand Logo, Current Rating, “T” for

Time-Lag

Clip Retention

Force applied at fuse center, perpendicular to

the long axis (@0.75 lbs. MIN)

Solderability

MIL-STD-202, Method 208 / IPC/ EIA /

JEDEC J-STD002B, Test Condition A

Humidity Test

MIL –STD-202, Method 103 @ 85ºC / 85%RH,

1000 hours

Resistance to

Solvents

MIL-STD-202, Method 215 (3 solvent types)

Product Characteristics

Operating

Temperature

-55ºC to 125ºC with proper derating

Thermal Shock

MIL-STD-202, Method 107,

Test Condition B

(5 cycles -65ºC to +125ºC)

Vibration

MIL-STD-202, Method 201

(10-55 Hz)

Moisture Resistance

MIL-STD-202, Method 106,

10 cycles

Salt Spray/

Atmosphere

MIL-STD-202, Method 101,

Test Condition B (48 hrs.), 5% NaCl in

De-ionized Water

Shock

MIL-STD-202, Method 213,

Test Condition I (100 G’s peak for 6

milliseconds)

Dimensions

6.10

[0.240]

1.45

[0.057]

2.69

[0.106]

2.69

[0.106]

3.7 ± 0.13

[0.146]

1 A

6.50 ± 0.20

[0.256]

3.90 ± 0.1

[0.154]

2.50 ± 0.2

[0.098]

3.70

[0.146]

3.40

[0.1

34]

"A"

"B"

0.10

7.26

[0.29]

3.00

[0.12]

2.46

[0.10]

2.40

[0.09]

Packaging

Option

Packaging

Speciﬁcation

Quantity

Quantity &

Packaging Code

Tape and Reel Surface Mount 1500 DRT

Part Numbering System

0157 005. D R T

SERIES

AMP CODE

qUANTITY CODE

PACKING OPTION

D = 1500 pcs

R = Tape and Reel

PCB Recommendation for Thermal Management

1. Minimum Copper Layer Thickness = 100um

2. Minimum Copper Trace Width = 10mm

Note:

Alternate methods of thermal management may be used. In such cases, under normal

operations, the maximum temperature of the fuse body should not exceed 80ºC in a 25ºC

ambient environment.

TIME-LAG FUSE

1 2 3

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